PART |
Description |
Maker |
MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸(16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu... ICSI[Integrated Circuit Solution Inc] Intersil, Corp.
|
AP2311GN-HF AP2311GN-HF-14 |
1.8 A, 60 V, 0.25 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp. Advanced Power Electronics ...
|
AP2305GN-HF AP2305GN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp. Advanced Power Electron...
|
TQFN5X5-40 |
Package Outline
|
Global Mixed-mode Techn...
|
WDFN3X3-10 |
Package Outline
|
Global Mixed-mode Techn...
|
PG-LQFP-64-13 PG-LQFP-64-5 PG-LQFP-64-4 |
Package Outline
|
Infineon
|
TQFN4X4-32 |
Package Outline
|
Global Mixed-mode Techn...
|
LQFP44 |
Package outline
|
Philips
|
WLCSP11X12-132 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-14-EP |
Package Outline
|
Global Mixed-mode Techn...
|